What is Chemical Mechanical Planarization and how is it used in the fiber optic cable assembly process?



CMP flock pile pads provide two functions in the polishing process for MT ferrules:

  • The primary purpose is to etch away the thermoset or thermoplastic on the MT ferrule and leave the fibers at a specific, controllable protrusion.
  • The secondary purpose is to polish the fibers.

Most polishing films have a single purpose: they polish. For MT ferrules, the CMP process uses a flock pile pad to provide a hybrid of chemical etching and abrasive polishing.

This dual-purpose film achieves both etching and polishing by combining two forces: chemical and mechanical.

The mechanical forces are motion, pressure, and velocity of the substrate (in this case, the connector) across the CMP flock pile pad.

The flock pile pad is a nylon material secured to a base-film material such as poly-ethylene terephthalate. The individual piles (nylon fibers) range from .3 to .5 mm in length.

This allows the chemical to fully achieve a good coverage surface of the MT ferrule while enabling it to etch away the thermoset or thermoplastic to achieve a flat and even surface.



READ THE FULL BLOG ARTICLE HERE:  Using Chemical Mechanical Planarization (CMP) to polish MT ferrules and get repeatable, predictable results







  Answered by AskFOC Technical Team April 3, 2019




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