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QUESTION:

What is the recommended minimum bond line thickness?

 

ANSWER:

A general guideline for minimum bond line thickness is between 25 to 150 microns (1 to 6 mils) – as a starting point. I recommend you choose a certain level to start, then make a few thicker and thinner versions of the bond. Take time to inspect completed bonds carefully to learn how a bond can fail, evaluate the performance for your application, and adjust bond line thickness as necessary to achieve a quality bond.

For every application, bond line thickness depends on:

  • The geometry of the bond area
  • The substrates being bonded
  • The material itself (the epoxy’s chemistry can dictate a specific minimum bond line thickness)
  • The temperature cycling the bond will need to survive
  • Proper surface preparation (improper cleaning can negate adhesion)
  • The cure time and method of cure
    • Bond line thickness and curing time go hand-in-hand to achieve sufficient adhesion and performance. Carefully review the epoxy manufacturer’s datasheet, including any charts showing bond line thickness versus cure time for the various curing methods.

 

 

READ THE FULL BLOG ARTICLE HERE: Bond Line Thickness & More: Answers to Common Epoxy Questions

 

ADDITIONAL CONTENT & RESOURCES:

 

 

 

  Answered by AskFOC Technical Team February 13, 2019

 

 

 

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When customers have technical questions, manufacturers often refer them to FOC as the technical expert of their equipment. FOC is resource of the know-how, the actual procedures and processes that go with each piece of equipment. It is the process that determines product meeting specifications on time. Decades of global, practical cable assembly production, fiber applications and specialty applications experience by our technical experts is out there, working daily with our customers, to improve their processes.