A video overview of the Sagitta CometX-SSP Laser Cleaving System for Single and Mullti-Fiber Connectors

The CometX-SSP enables efficient and quick laser cleaving of the fiber after the epoxy curing step. The cleaving is non-contact resulting in zero chips or cracks, and provides the best post-cleave conditions for the most efficient polishing process. However, to achieve an extremely efficient process other factors also need to be considered. These include the quality of the connector’s pre-polished geometry, pre-radius and surface quality. When all aspects are addressed a single diamond step polishing process is possible, and in some instances a process without diamond might be attenable. Please contact our technical team for further details.

  • Single polishing step
  • Laser cleaving eliminates operator/tool dependent cleave quality
  • Eliminates cleave related multimode fiber core cracking
  • Minimal epoxy “pond” left
  • Short and simple polishing process (around 1 min/batch)
  • Minimal use of polishing equipment and materials
  • Higher yield and throughput; Remove interdependencies

Click here for complete information on the Sagitta CometX-SSP Laser Cleaving System for Single and Multi-Fiber Connectors

cleaving process
English English Français Français Deutsch Deutsch Español Español/Mexican
Copy link
Powered by Social Snap