EPO-TEK® 301-2 Optically Transparent Epoxy, Heat Cure (4g)

The EPO-TEK® 301-2 Epoxy is a two-component, optically transparent fiber optic epoxy and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics. EPO-TEK 301-2 can be used for bonding glass, quartz, metals, and most plastics. Recommended Cure: 80°C (176°F) for 3 hours. Available in 4g packet.

Features:

• Pot Life: 8 Hours
• Can resist yellowing over 17 days of continuous UV light exposure
• Resistant to impact and vibration
• Low-stress adhesive
• Passes NASA low outgassing standard ASTM E595 with proper cure
• Easy to use for potting, casting, encapsulation, and adhesive applications
• Excellent adhesion to glass, quartz, metals, wood, and most plastics
• Can be used for impregnating wooden or porous objects for artifact restoration

Applications:

• Semiconductor:
  • Underfill for flip chips, glob-top encapsulation over wire bonds
  • Spin coating at wafer level, including wafer-level packaging
• Fiber Optic Adhesive:
  • Fiber bundling and ferrule termination
  • Mounting optics inside fiber components
  • Bonding glass coverslips over V-grooves
  • Supports visible and IR spectral transmission

Physical Properties:

• Consistency: Pourable liquid
• Viscosity (23°C): 225-445 cPs
• Glass Transition Temperature (Tg): ≥ 80°C (degree Celsius); ≥ 176°F (degree Fahrenheit)
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 61 × 10⁻⁶ in/in °C
  • Above Tg: 180 × 10⁻⁶ in/in °C
• Shore D Hardness: 80
• Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F

Optical Properties @ 23°C (73.4°F):

• Spectral Transmission:
  • ≥ 94% @ 320 nm
  • ≥ 99% @ 400-1200 nm
  • ≥ 98% @ 1200-1600 nm
• Refractive Index: 1.5318 @589 nm

See Datasheet for additional properties and application notes