EPO-TEK® 301-2FL Clear Epoxy, Heat Cure (8oz)

The EPO-TEK^® 301-2FL Low Stress, Optical Clear Epoxy is a two-component adhesive commonly used for potting, casting, and encapsulation. It’s also suitable for semiconductor applications such as flip-chip underfill and glob-top encapsulation. This more flexible version of EPO-TEK® 301-2 offers strong impact and vibration resistance, making it ideal for bonding optics in OEM and scientific instruments. This epoxy is capable of both heat cure and room temperature cure. Recommended Cure: 80°C for 3 Hours. Available in a 8-oz kit.

Features:

• Pot life: 10 Hours
• Suitable for LCD optical lamination and sealing of glass plates
• Resists yellowing after 17 days of continuous UV exposure; suitable for LED encapsulation
• Easy to use for potting, casting, encapsulation, and general adhesive applications
• Compliant, low-stress adhesive for vibration-prone environments and sensitive optical assemblies
• Excellent adhesion to glass, quartz, metals, wood, and most plastics
• Can also be used to impregnate wooden or porous artifacts for restoration work

Applications:

• Semiconductor:
  • Underfill for flip chips, glob-top encapsulation over wire bonds
  • Spin coating at wafer level
• Fiber Optic Adhesive:
  • Fiber bundling and terminating fiber into ferrule
  • Mounting optics inside fiber components
  • Bonding glass coverslips over V-grooves
  • Supports visible and IR spectral transmission

Physical Properties:

• Consistency: Pourable liquid
• Viscosity (23°C): 100 - 200 cPs
• Glass Transition Temperature, Tg: ≥ 45°C
• Shore D Hardness: 70
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 56 x 10^-6 in/in°C
  • Above Tg: 211 x 10^-6 in/in°C
• Suggested Operating Temperature: < 250 °C (Intermittent); < 482°F

Optical Properties @ 23°C:

• Spectral Transmission:
  • ≥ 97% @ 1,000-1,600 nm
  • ≥ 99% @ 400-1,000 nm
• Refractive Index: 1.5102 @ 589 nm

See Datasheet for additional properties and application notes