EPO-TEK® 302 Fast Setting Epoxy, Room Temperature Cure (8oz)

The EPO-TEK^® 302 Fast Setting Epoxy is a two-component, fast-gelling, room-temperature curing adhesive designed for electronics, optical, and general-purpose applications. It provides transmission in the VIS and NIR ranges and can be used directly in the optical pathway. Recommended Cure: 23°C (73.4°F) for 2 Hours. Available in an 8oz kit.

Features:

• Pot Life: 10 Minutes
• Due to its versatility, it may be used to adhere, seal, pot, or encapsulate.
• Allows for % transmission in VIS and NIR range. It can be used as an adhesive in the optical pathway of light.
• Convenient and easy to use 1:1 mix ratio allows for hand, meter mix, or specialty packaging.

Applications:

• Fiber Optics: Suitable for field curing/assembly of fiber optic connectors and couplers; recommended for fiber splicing
• Field Assembly: Fast gel and cure times (2–3 hours) enable mixing and curing in the field
• Electronics: Ideal for rapid prototyping with no oven cure required
• Optics: Supports active alignment of lenses, prisms, diodes, filters, and other components
• General Use: Appropriate for repairs, restoration work, arts, crafts, and hobby projects

Physical Properties:

• Consistency: Pourable liquid
• Viscosity (23°C): 5,000-10,000 cPs
• Glass Transition Temperature, Tg: ≥ 40°C (degree Celsius); ≥ 104°F (degree Fahrenheit)
• Shore D Hardness: 73
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 52 x 10^-6 in/in°C
  • Above Tg: 191 x 10^-6 in/in°C
• Suggested Operating Temperature: < 200 °C (Intermittent); < 392°F

Optical Properties:

• Spectral Transmission:
  • > 75% @ 340 – 420 nm
  • > 85% @ 440-900 nm
  • > 88% @ 900-1600 nm
• Refractive Index (uncured): 1.5442 @589 nm

See Datasheet for additional properties and application notes