EPO-TEK® 330 Low Viscosity Epoxy, Thermally & Electrically Insulating, Heat Cure (8 oz)

The EPO-TEK^® 330 Low Viscosity Optical Epoxy is a two-component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, and fiber optics applications. Recommended Cure: 150°C (302°F) for 1 Hour. Available in an 8 oz kit.

Features:

• Built-in color change from clear to amber when fully cured, enabling in-line inspection of adhesive joints
• Unfilled epoxy resin allows for % transmission in the VIS and NIR
• Low viscosity allows for wicking and capillary action
• Suitable for room-temperature, low-temperature, or elevated-temperature box-oven curing
• Pot life: 6 Hours

Applications:

• Semiconductor: Capillary-flow underfill for flip-chip mounted die
• Fiber Optics:
  • PM fiber (polarization-maintaining fiber) applications such as gyroscope coils
  • Fiber termination into ferrules

Physical Properties:

• Consistency: Pourable Liquid
• Viscosity (23°C): 350 - 550 cPs
• Glass Transition Temperature, Tg: ≥ 90°C (degree Celsius); ≥ 194°F (degree Fahrenheit)
• Shore D Hardness: 87
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 65 x 10^-6 in/in°C
  • Above Tg: 162 x 10^-6 in/in°C
• Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F

Optical Properties @ 23°C (73.4°F):

• Spectral Transmission:
  • > 97% @ 700 - 1600 nm
  • > 88% @ 600 nm
  • > 51% @ 500 nm
• Refractive Index (uncured): 1.5345 @ 589 nm

See Datasheet for additional properties and application notes