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EPO-TEK® 353NDP High Temperature Epoxy, Humidity Resistant, Low Outgassing, Heat Cure (4g)

ET353NDP-4G

EPO-TEK® 353NDP High Temperature Epoxy, Humidity Resistant, Low Outgassing, 2-Part Epoxy, Heat Cure (4g)
EPO-TEK® 353NDP is a two-component epoxy engineered to provide exceptional resistance to high temperatures and high-humidity environments. Designed to meet the demands of AI and machine learning infrastructure, it is well-suited for Telecom/Datacom applications as well as the aerospace, defense, automotive, and medical industries. This adhesive is available in a 4g packet.

Recommended Cure: 120°C / 1 Hour

Features of 353NDP:

  • HI-REL (High Reliability) version of EPO-TEK® 353ND
  • Proven 2,000-hour reliability at 85°C/85% RH, supporting 800G and 1.6T high-density systems
  • Passes NASA ASTM E595 low outgassing adhesive requirements
  • Low viscosity for excellent wicking and wetting in miniature assemblies
  • High die shear strength for durable, reliable bonds
  • Reasonable pot life that enables low-temperature curing processes
  • Amber color change upon cure for visual process verification
  • Compliant with Telcordia GR-1221 requirements

Applications:

  • Optical, Telecom, and Datacom (Data centers, AI and Machine Learning)
  • Electronics assembly
  • Aviation
  • Defense
  • Automotive
  • Medical

Physical Properties:

  • Color (before cure):
    • Part A: Clear
    • Part B: Amber
  • Consistency: Pourable liquid
  • Viscosity (23°C) @ 50 rpm: 3,600 cPs
  • Glass Transition Temperature, Tg: ≥ 90°C (Dynamic Cure: 20–200°C / ISO 25 Min; Ramp 10–200°C @ 20°C/Min)
  • Coefficient of Thermal Expansion (CTE):
    • Below Tg: 52 × 10⁻⁶ in/in/°C
    • Above Tg: 185 × 10⁻⁶ in/in/°C
  • Shore D Hardness: 85
  • Lap Shear @ 23°C: > 2000 psi
  • Die Shear @ 23°C:
    • 38 Kg
    • 32 Kg (after 7d @ 85°C / 85% RH)
    • 15 Kg (after 2000+K433:K435h @ 85°C / 85% RH)
  • Degradation Temperature: 410°C
  • Weight Loss
    • @ 200°C: 0.09%,
    • @ 250°C: 0.28%
    • @ 300°C: 0.72%
  • Suggested Operating Temperature: < 350°C (Intermittent)
  • Storage Modulus: 2,213 MPa @ 23°C

Electrical & Thermal Properties

  • Volume Resistivity @ 23°C: ≥ 1.8 × 10¹³ Ohm-cm
  • Dielectric Constant (1KHz): 3.17
  • Dissipation Factor (1KHz): 0.005

Optical Properties @ 23°C

  • Spectral Transmission:
    • ≥ 50% @ 550 nm
    • ≥ 95% @ 1100–1600 nm
    • ≥ 98% @ 800–1000 nm
  • Refractive Index: 1.569 @ 589 nm

NASA ASTM E595 Outgassing Performance

  • Cure Schedule: 150°C - 1 hour
  • Total Mass Loss (TML): 0.76%
  • Collected Volatile Condensable Material (CVCM): < 0.01%

Datasheet

SDS (Part A)

SDS (Part B)

Technical Support

A purchase from Fiber Optic Center includes access to a team of experienced technical experts with hands-on industry experience. From on-site support and training to troubleshooting, process development, yield improvement, evaluations, and calibrations, we provide the practical guidance and expertise needed to help you maximize productivity and achieve exceptional results. Click here for more details on the technical advantage of Fiber Optic Center.

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