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EPO-TEK® 375 High Temperature Epoxy, Heat Cure (4g)

ET375-4G

EPO-TEK® 375 Low Viscosity, High Temperature, Heat Cure, 2-Part Fiber Optic Epoxy, 4g packet
The EPO-TEK® 375 Low Viscosity, Fiber Optic Epoxy is a two-component, high-temperature epoxy designed for fiber optic, semiconductor, and hybrid applications. Available in a 4 gram packet.

Recommended Cure: 150°C (302°F) for 1 Hour. 

Features of 375:

  • Pot Life: 4 Hours - Allows for low temperature curing to be realized and shows an amber color change upon cure.
  • High-temperature epoxy
  • Low Viscosity
  • Compliant with Telcordia GR-1221

Applications for 375:

  • Fiber optic adhesive:
    • Ideal for sealing fiber into ferrules and supporting optical transmission from 800–1550 nm
    • Used for fiber component packaging, active alignment of optics, environmental sealing of opto-packages, and V-groove arrays.
  • Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
  • Hybrid:
    • Providing near hermetic seals and UHV seals in sensor devices and resisting high-temperature packaging.
    • Down-hole petrochemical fiber optic sensors resisting >200°C (392°F) field conditions.
  • Electronics assembly:
    • Used as a dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices.
    • Impregnates and insulates copper coil windings; bonds ferrite cores and magnets.
    • Structural-grade epoxy found in hard-disk drive devices; bonding of stainless steel metals, Kapton, and magnets.

Physical Properties:

  • Color (before cure)
    • Part A: Clear/Colorless
    • Part B: Amber
  • Consistency: Pourable liquid
  • Viscosity (23°C) @ 50 rpm: 3,000 - 5,000 cPs
  • Glass Transition Temperature, Tg: ≥ 100°C
  • Coefficient of Thermal Expansion (CTE):
    • Below Tg: 48 × 10⁻⁶ in/in °C
    • Above Tg: 192 × 10⁻⁶ in/in °C
  • Shore D Hardness: 88
  • Lap Shear @ 23°C: > 2,000 psi   
  • Die Shear @ 23°C: ≥ 10 Kg (3,556 psi)
  • Weight Loss:
    • @ 200°C: 0.06 %
    • @ 250°C: 0.16 %
    • @ 300°C: 0.49 % 
  • Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F

Electrical and Thermal Properties:

  • Volume Resistivity @ 23°C: ≥ 1 x 1013 Ohm-cm   
  • Dielectric Constant (1KHz): 3.34   
  • Dissipation Factor (1KHz): 0.004 

Optical Properties @ 23°C:

  • Spectral Transmission:
    • ≥ 94% @ 600-790 nm
    • ≥ 98% @ 800-1500 nm
  • Refractive Index: 1.5692 @589 nm

See Datasheet for additional properties and application notes

Datasheet

SDS (Part A)

SDS (Part B)

Mixing Instructions

Technical Support

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