EPO-TEK® 375 High Temperature Epoxy, Heat Cure (8oz)

The EPO-TEK^® 375 Low Viscosity, Fiber Optic Epoxy is a two-component, high-temperature epoxy designed for semiconductor, hybrid, and fiber optic applications. Recommended Cure: 150°C (302°F) for 1 Hour. Available in an 8oz kit.

Features:

• Pot Life: 4 Hours - Allows for low temperature curing to be realized and shows an amber color change upon cure.
• High-temperature epoxy
• Low Viscosity

Applications:

• Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
• Hybrid:
  • Providing near hermetic seals and UHV seals in sensor devices and resisting high-temperature packaging.
  • Down-hole petrochemical fiber optic sensors resisting >200°C (392°F) field conditions.
• Fiber optic adhesive:
  • Ideal for sealing fiber into ferrules and supporting optical transmission from 800–1550 nm
  • Used for fiber component packaging, active alignment of optics, environmental sealing of opto-packages, and V-groove arrays.
• Electronics assembly:
  • Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices.
  • Impregnates and insulates copper coil windings; bonds ferrite cores and magnets.
  • Structural-grade epoxy found in hard-disk drive devices; bonding of stainless steel metals, kapton, and magnets.

Physical Properties:

• Consistency: Pourable liquid
• Viscosity (23°C): 3,000 - 5,000 cPs
• Glass Transition Temperature (Tg): ≥ 100°C (degree Celsius); ≥ 212°F (degree Fahrenheit)
• Coefficient of Thermal Expansion (CTE):
• Below Tg: 48 × 10⁻⁶ in/in °C
• Above Tg: 192 × 10⁻⁶ in/in °C
• Shore D Hardness: 88
• Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F

Optical Properties @ 23°C (73.4°F):

• Spectral Transmission:
  • ≥ 94% @ 600-790 nm
  • ≥ 98% @ 800-1500 nm
• Refractive Index: 1.5692 @589 nm

See Datasheet for additional properties and application notes