EPO-TEK® 377 High Temperature Fiber Optic Epoxy, Heat Cure (8oz)

The EPO-TEK^® 377 High Temperature Epoxy is a two-component, high Tg epoxy ideal for fiber optics, semiconductor, and optical applications. Its low viscosity ensures excellent handling and versatility in application methods, including encapsulating and potting. NASA-approved for low outgassing. Recommended Cure: 150°C (302°F) for 1 Hour. Available in an 8oz kit.

Features:

• Pot life: 24 hours
• Low viscosity epoxy with excellent handling; suitable for encapsulating or potting
• Can be applied by hand, pouring, spin coating, brushing, dipping, or automated dispensers
• NASA-approved, low outgassing epoxy (ASTM E595)

Applications:

• Semiconductor:
  • Spin coating at wafer level for MEMS fabrication (pressure sensors, accelerometers)
  • Wafer-to-wafer bonding in CSP
  • Capillary underfill of flip-chip packaged die
• Optical / Opto-Electronic Packaging:
  • NIR transmission (700–900 nm) > 95%
  • Glass or hermetic sealing of LCD plates
  • Hermetic sealing of IR-filter windows to aluminum caps of TO-can hybrid packaged IR sensors
• Industrial / Chemical Resistance: Resistant to salt water, hydraulic fluids, motor oil, alcohol, 10% nitric acid, 10% sulfuric acid, 10% ammonia solution, and most solvents

Physical Properties:

• Consistency: Pourable liquid
• Viscosity (23°C): 150 - 300 cPs
• Glass Transition Temperature (Tg): ≥ 95°C (degree Celsius); ≥ 203°F (degree Fahrenheit)
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 57 × 10⁻⁶ in/in °C
  • Above Tg: 210 × 10⁻⁶ in/in °C
• Shore D Hardness: 67
• Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F

Optical Properties @ 23°C (73.4°F):

• Spectral Transmission:
  • ≥ 90% @ 600-1000 nm
  • ≥ 98% @ 1000-6800 nm
• Refractive Index: 1.5195 @ 589 nm

See Datasheet for additional properties and application notes