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EPO-TEK® 320 Black Epoxy, Room Temperature Cure (2.5g)
ET320-2.5G
EPO-TEK® 320 General Bonding, Room Temp Cure, 2-Part Epoxy, 2.5 Gram Packet.
The EPO-TEK® 320 Thixotropic Optical Epoxy Adhesive is a two-component, low viscosity and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a widely used fiber optic epoxy. Recommended Cure: 65°C (149°F) for 2 Hours. Available in a 2.5 gram packet.
See Datasheet for additional properties and application notes
Features:
- Black, optically opaque epoxy with low viscosity
- Blocks light across the IR and visible spectrum (185–2500 nm)
- Suitable for room-temperature, low-temperature, or elevated-temperature box-oven curing
- Pot life: 1 Hour
Applications:
- Optical:
- Light-blocking epoxy for VIS and NIR photonics packaging
- Sensor packaging (including IR detectors in TO-cans)
- Bonding of lenses, prisms, diodes, and various optical components
- Adheres well to metals, most plastics, and glass
- Fiber Optics:
- Sealing or potting fibers into boots, ferrules, and feed-throughs in package walls
Physical Properties:
- Consistency: Slightly thixotropic paste
- Viscosity (23°C): 700 - 1,200 cPs
- Thixotropic Index: 5.7
- Glass Transition Temperature, Tg: ≥ 55°C (degree Celsius); ≥ 131°F (degree Fahrenheit)
- Shore D Hardness: 83
- Coefficient of Thermal Expansion (CTE):
- Below Tg: 58 x 10-6 in/in°C
- Above Tg: 169 x 10-6 in/in°C
- Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F
- Particle Size: ≤ 20 microns
Optical Properties @ 23°C (73.4°F):
- Spectral Transmission: < 1 % @ 300-2500 nm
See Datasheet for additional properties and application notes
Datasheet
SDS (Part A)
SDS (Part B)
Mixing Instructions
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