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EPO-TEK® 323LP High Temperature Epoxy, Heat Cure (15g)
ET323LP-15G
Extended Pot Life 24 hours
Recommended Cure: 150°C / 1 Hour
Features of 323LP:
- Pot Life: 24 hours
- It has an amber color change upon cure.
- High-temperature epoxy
- Telcordia GR-1221 Compliant
- Resisting >200°C field conditions
- Transmitting light in the optical pathway from 800 to 1,550 nm range
Applications:
- Fiber optic adhesive designed to meet Telcordia 1221:
- Sealing fiber into ferrules, transmitting light in the optical pathway from 800-1,550 nm range.
- Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.
- Semiconductor: Wafer-to-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
- Hybrid:
- Providing near hermetic seals and UHV seals in sensor devices, resisting high-temperature packaging.
- Down-Hole petrochemical fiber optic sensors, resisting >200°C (392 °F) field conditions.
- Electronic Assembly:
- Used as a dielectric layer in the fabrication of capacitors, laminating PZT piezoelectrics.
- Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
Physical Properties:
- Color before cure:
- Part A: Clear to slight yellow
- Part B: Yellow
- Consistency: Pourable liquid
- Viscosity (23°C) @ 50 rpm: 3,500 - 5,000 cPs
- Glass Transition Temperature, Tg: ≥ 100°C
- Coefficient of Thermal Expansion (CTE):
- Below Tg: 51 x 10-6 in/in°C
- Above Tg: 185 x 10-6 in/in°C
- Shore D Hardness: 88
- Lap Shear @ 23°C: > 2,000 psi
- Die Shear @ 23°C: ≥ 20 Kg (7,112 psi)
- Weight Loss:
- @ 200°C: 0.31%
- @ 250°C: 0.46%
- @ 300°C: 0.85%
- Suggested Operating Temperature: < 300 °C (Intermittent)
- Storage Modulus: 444,110 psi
Electrical and Thermal Properties:
- Volume Resistivity @ 23°C: ≥ 3 x 1012 Ohm-cm
- Dielectric Constant (1KHz): 2.62
- Dissipation Factor (1KHz): 0.003
Optical Properties:
- Spectral Transmission:
- ≥ 94% @ 820-1,620 nm
- ≥ 90% @ 640-800 nm
- Refractive Index: 1.5704 @ 589 nm
Datasheet
SDS (Part A)
SDS (Part B)
Technical Support
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