Epo-Tek® ET323LP Heat Cure Epoxy (2.5G)

EPO-TEK 323LP is a two-component, high-temperature epoxy designed for semiconductor, hybrid, fiber, optical and medical applications. It is a longer pot life alternative of EPO-TEK 353ND. Extended Pot Life 24 hours.

Advantages and Suggested Application Notes:

• 24-hour pot life to promote mass production usage. It has an amber color change upon cure.
• Semiconductor: Wafer-to-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
• Hybrid:
  • Providing near hermetic seals and UHV seals in sensor devices, resisting high-temperature packaging. ○ Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions.
• Fiber optic adhesive designed to meet Telecordia 1221:
  • Sealing fiber into ferrules, transmitting light in the optical pathway from 800-1,550 nm range.
  • Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.
• Electronic Assembly:
  • Used as dielectric layer in the fabrication of capacitors; laminating PZT peizoelectrics.
  • Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.