Epo-Tek® ET353ND Black Heat Cure Epoxy (2.5G)

EPO-TEK® 353ND Black is a two-component, high-temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications.

Advantages and Suggested Application Notes:

• EPO-TEK 353ND Black has been color-coded black for optical applications requiring opacity against light in IR and VIS region.
• Reasonable pot life that allows for low-temperature curing to be realized.
• Semiconductor suggested applications: wafer-wafer bonding of CSP, fabrication of MEMs devices, flip chip underfill.
• Hybrid suggested applications: providing near hermetic seals in sensor devices, resisting high-temperature packaging.
• Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications:
  • Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range.
  • Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.
  • Down-Hole petrochemical fiber optic sensors, resisting >200 C field conditions
• Electronics Assembly suggested applications:
  • Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices.
  • Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
  • Structural grade epoxy found in hard-disk drive devices; bonding of SST metals, kapton, and magnets.

See physical, optical and electrical/thermal properties in the datasheet.