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EPO-TEK® 353ND High Temperature Epoxy, Heat Cure (2.5g)
ET353ND-2.5G
Features:
- Pot Life: ≤ 3 Hours
- It has an amber color change upon cure.
- Passes NASA low outgassing standard ASTM E595 with proper cure
- Industry standard with high Tg, high strength, superior moisture resistance and excellent reliability
- Designed to meet Telecordia 1221
- Electrically and thermally insulating
Applications:
- Semiconductor:
- Wafer-to-wafer bonding of CSP
- Fabrication of MEMS devices
- Flip chip underfill
- Hybrid:
- Providing near-hermetic and UHV seals in sensor devices
- Resisting high-temperature packaging
- Down-hole petrochemical fiber optic sensors, operating at >200 °C
- Fiber Optic Adhesive:
- Sealing fiber into ferrules, transmitting light in the 800–1550 nm range
- Fiber component packaging
- Adhesive for active alignment of optics
- Environmental sealing of opto-packages and V-groove arrays
- Designed to meet Telcordia 1221 standards
- Electronics Assembly:
- Dielectric layer in capacitor fabrication
- Laminating PZT ferroelectrics in ultrasound or inkjet devices
- Impregnating and insulating copper coil windings in motors and inductors
- Bonding ferrite cores and magnets
- Structural epoxy in hard-disk drives; bonding SST metals, Kapton, and magnets
Physical Properties:
- Consistency: Pourable liquid
- Viscosity (23°C): 3,000 - 5,000 cPs
- Glass Transition Temperature, Tg: ≥ 90°C (degree Celsius); ≥ 194°F (degree Fahrenheit)
- Coefficient of Thermal Expansion (CTE):
- Below Tg: 54 x 10-6 in/in°C
- Above Tg: 206 x 10-6 in/in°C
- Shore D Hardness: 85
- Suggested Operating Temperature: < 350 °C (Intermittent); < 662°F
Optical Properties:
- Spectral Transmission:
- ≥ 50% @ 550 nm
- ≥ 95% @ 1100-1600 nm
- ≥ 98% @ 800-1000 nm
- Refractive Index (uncured): 1.5694 @589 nm
Datasheet
SDS (Part A)
SDS (Part B)
Mixing Instructions
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