EPO-TEK® 353ND High Temperature Epoxy, Heat Cure (8oz)

The EPO-TEK® 353ND Epoxy is a two component, high-temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Available in an 8oz kit. 

Recommended Cure: 150°C / 1 Hour

Features of 353ND:

• Pot Life: ≤ 3 Hours
• Passes NASA low outgassing standard ASTM E595 with proper cure
• Fiber optic adhesive designed to meet Telcordia GR-1221

Applications for 353ND:

• Sealing fiber into ferrules, transmitting light in the optical pathway from 800-1550 nm range.
• Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
• Providing near hermetic seals and UHV seals in sensor devices, resisting high-temperature packaging
• Wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill

Physical Properties:

• Color (before cure): 
  • Part A: Clear
  • Part B: Amber
• Consistency: Pourable liquid
• Viscosity (23°C): 3,000 - 5,000 cPs
• Glass Transition Temp: ≥ 90°C
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 54 x 10^-6 in/in°C
  • Above Tg: 206 x 10^-6 in/in°C
• Shore D Hardness: 85
• Suggested Operating Temperature: < 350 °C (Intermittent); < 662°F 

Optical Properties:

• Spectral Transmission:
  • ≥ 50% @ 550 nm
  • ≥ 95% @ 1100-1600 nm
  • ≥ 98% @ 800-1000 nm
• Refractive Index (uncured): 1.5694 @589 nm

See Datasheet for additional properties and application notes