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Epo-Tek® ET360 Heat Cure Epoxy (4G)
ET360-4G
Epo-Tek® ET360 Heat Cure, 2-Part Epoxy, 4 Gram Packet
EPO-TEK® 360 is a two-component, high-temperature grade epoxy for semiconductor, electronics, and fiber optics applications.
Advantages and Suggested Application Notes:
Advantages and Suggested Application Notes:
- Built-in color changes from clear to amber when cured properly. The color change can be used for in-line inspection of epoxy joints and adhesive fillet.
- Unfilled epoxy resin allows for % transmission in the VIS and NIR to be realized.
- Low viscosity allows for wicking and capillary action
- Suggested Applications:
- Semiconductor: capillary flow underfill for Flip Chip mounted die.
- Fiber Optic: polarizing maintaining fibers (PMF) found in gyroscope coils; fiber termination into ferrule.
- Electronics: impregnating copper coil windings found in motors or SMD inductor coils; adhesion to ferrite cores.
