EPO-TEK® H20E Electrically Conductive Silver Epoxy, Heat Cure - Pre-Mixed and Frozen (3cc Syringe)

The EPO-TEK^® H20E Electrically Conductive Epoxy is a two-component, solvent-free silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. Its high thermal conductivity also makes it ideal for thermal management. Recommended Cure: 150°C (302°F) for 1 Hour. Available in a 3cc automatic syringe.

Features:

• Pot life: 2.5 days
• Silver-filled epoxy with a smooth, thixotropic consistency (Thixotropic 4.6)
• Die shear strength: > 10 kg
• NASA-approved, low outgassing epoxy (ASTM E595)

Applications:

• Semiconductor IC Packaging: Die attach, flip-chip applications, ultrafine-pitch SMD printing
• Hybrid Microelectronics: SMD attach adhesive, EMI/RF shielding for RF, microwave, and IR devices
• Solar-Photovoltaic: Solar cell stringing adhesive, chip attachment in solar concentrators
• Optoelectronics Packaging: Die bonding for laser diodes, fiber optic components, and LED chips
• Can be applied by many dispensing, stamping, and screen printing techniques

Physical Properties:

• Consistency: Smooth thixotropic paste
• Viscosity (23°C): 2,200 - 3,200 cPs
• Thixotropic Index: 4.6
• Glass Transition Temperature, Tg: ≥ 80°C (degree Celsius); ≥ 176°F (degree Fahrenheit)
• Shore D Hardness: 75
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 31 x 10^-6 in/in°C
  • Above Tg: 158 x 10^-6 in/in°C
• Suggested Operating Temperature: < 300°C (Intermittent); < 572°F
• Particle Size: ≤ 45 microns

Electrical and Thermal Properties:

• Thermal Conductivity: 2.5 W/mK based on the standard method: Laser Flash
• Thermal Conductivity: 29 W/mK based on Thermal Resistance Data: R = L x K^-1 x A^-1)

See datasheet for additional properties and application notes