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Epo-Tek® OE138 Heat Cure Epoxy (2.5G)
ETOE138-2.5G
Epo-Tek® OE138 Heat Cure, 2-Part Epoxy, 2.5 Gram Packet
EPO-TEK® OE138 is a two-component epoxy with an intermediate viscosity range between EPO-TEK 353ND and EPO-TEK 353ND-T. It is designed for semiconductor glob top applications, as well as use in medical and fiber optic industries.
Advantages and Suggested Application Notes:
Advantages and Suggested Application Notes:
- Suitable for circuit assembly applications such as stacking SMDs, bonding ferrite cores, bonding inductor coils and power devices.
- Used in chip-on-board glob tops for encapsulation and environmental protection.
- High-temperature adhesive for hybrids and downhole sensors which can resist up to 300 C for extended periods of time.
- Can be applied by screen printing, spatula, automatic dispenser or by hand.
- Recommended for bonding metals, glass, ceramic, and many types of plastic.
- OE138 changes to a dark amber color when properly cured for easy visual inspection.
