EPO-TEK® OG116 High Viscosity Adhesive, High Tg, UV Cure (3cc Syringe)

EPO-TEK® OG116 is a single component, high refractive index, high-Tg, high-viscosity, UV light curing adhesive. It was designed for optoelectronic applications, including fiber optic packaging, sensor devices, SCI-OEM optics, and general electronic assembly. Available in a 3cc syringe for manual application. 

Recommended Cure: Iron-Doped Mercury Flood Lamp → 30 sec. 100 mW/cm² @ 240–365 nm

Features of OG116:

• UV-cure adhesive
• Epoxy-based thermal post-cure
• High glass transition temperature (Tg)
• Strong, reliable adhesion
• Good chemical resistance
• High refractive index

Physical Properties:

• Color (before cure): Clear/Colorless
• Consistency: Viscous liquid
• Viscosity (23°C) @ 2.5 rpm: 80,000 - 105,000 cPs
• Glass Transition Temp: ≥ 135°C (275°F)
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 56 × 10⁻⁶ in/in/°C
  • Above Tg: 165 × 10⁻⁶ in/in/°C
• Die Shear:
  • UV Cure: ≥10 Kg / 3,556 psi
  • UV Cure + 23°C / 24 Hours: 26.3 Kg / 9,352.3 psi
  • UV Cure + 80°C / 1 Hour: 27.0 Kg / 9,601.2 psi
  • UV Cure + 120°C / 1 Hour: 29.3 Kg / 10,419.1 psi
• Degradation Temp: 424°C
• Weight Loss:
  • @ 200°C: 0.19%
  • @ 250°C: 0.40%
  • @ 300°C: 0.68%
• Suggested Operating Temperature: < 300°C (Intermittent) (< 572°F)
• Storage Modulus: 215,745 psi

Optical Properties @ 23°C:

• Spectral Transmission:
  • ≥ 98% @ 560–1,660 nm
  • 89% @ 400 nm
• Refractive Index (uncured): 1.5733 @ 589 nm
• Refractive Index (cured): 1.5892 @ 589 nm