EPO-TEK® OG198-54 Electrically and Thermally Insulating Epoxy, UV & Heat Cure (3cc Syringe)

The EPO-TEK® OG198-54 Low Viscosity Epoxy is a single-component, electrically and thermally insulating UV cure epoxy. This high Tg epoxy features UV shadow cure, which enhances performance after a thermal post-cure and provides a significant cure. Available in a 3cc automatic epoxy syringe. REFRIGERATED STORAGE REQUIRED 

Recommended Cure: Iron-Doped Mercury Flood Lamp > 30 sec. 100 mW/cm² @ 240-365 nm

Features for OG198-54:

• Electrically and Thermally Insulating
• UV shadow cure allows for enhanced performance after a thermal post cure and significant cure propagation into shadow area.
• High Tg
• Strong transmission in the Visible and regions.
• Compliant with Telcordia GR-1221
• Passes NASA outgassing requirements (ASTM E595)

Applications:

• Active alignment of optics
• Bonding fibers to V-grooves
• Fiber pigtails
• Alignment in optoelectronic hybrids
• Semiconductor devices

Physical Properties:

• Color (before cure): Clear/Colorless
• Consistency: Pourable liquid
• Viscosity (23°C) @ 100rpm: 200 - 450 cPs
• Glass Transition Temperature, Tg: ≥ 115°C
• Shore D Hardness: 86
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 74 x 10^-6 in/in°C
  • Above Tg: 145 x 10^-6 in/in°C
• Die Shear:
  • UV Cure: ≥ 10 kg (3,556 psi)
  • UV Cure + 23°C/24 Hours: 20.8 kg (7,396.5 psi)
  • UV Cure + 80°C/1 Hour: 22.2 kg (7,894.3 psi)
• Degradation Temp: 369°C (696.2°F)
• Weight Loss:
  • @ 200°C: 0.24%
  • @ 250°C: 0.62%
  • @ 300°C: 1.80%

• Suggested Operating Temperature: < 300°C (Intermittent); < 572°F  
• Storage Modulus: 449,431 psi

Optical Properties:

• Spectral Transmission: ≥ 97% @ 460-1,680 nm
• Refractive Index (uncured): 1.5046 @ 589 nm
• Refractive Index (cured): 1.5256 @ 589 nm

NASA Low Outgassing (ASTM E-595):

• TML (Total Mass Loss): 0.53%
• CVCM (Collected Volatile Condensable Material): 0.00%

See Datasheet for additional properties and application notes