For high power connectivity, where epoxy-less free-standing SMA’s is used, most companies use supportive wax like CrystalBond in the SMA connector to prevent the fiber from breaking during polishing while it needs to be removed afterward which is a time-consuming costly operation. Using a laser cleaving operation eliminates the need of using supportive wax as the fiber protrudes very little from the SMA tip allowing directly a polishing operation when a high-stability polisher like Domaille Engineering is used. The time reduction is significant while the less lapping film is consumed.
Additional resources from the FOC team include:
- Category Resource:
- View the Glossary, Acronyms, Military Specifications for Connectors
- Q&A Resource: email technical questions to AskFOC@focenter.com
Have questions about this FOC Tip?
Contact FOC with questions at: (800) 473-4237 / 508-992-6464 or email: FiberOpticCenter@focenter.com and we will respond ASAP.