Epo-Tek® ET353NDT Heat Cure Epoxy (2.5G)

EPO-TEK® 353ND-T is a two-component, highly thixotropic epoxy with non-flowing properties and high-temperature resistance.

Advantages and Suggested Application Notes:

• Suitable for fiber optic and circuit assembly applications.
• Recommended for bonding metals, glass, ceramics and many types of plastic.
• High-temperature adhesive for hybrids and medical devices; it can resist within the 300°C range for long periods of time.
• Circuit assembly applications; staking SMD's to PCB, bonding ferrite cores together in copper coil windings, inductor coils and power devices; suitable for COB glob top DAM material.
• Alternative product versions available with distinct viscosity ranges
• Can be applied by screen printing, spatula, hand-held or automatic dispensing equipment.
• Amber color changes when properly cured for easy visual ID and inspection.

See physical, optical and electrical/thermal properties in datasheet.