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Epo-Tek® ET301-2 General Room Temp Cure Epoxy (2.5G)
ET301-2-2.5G
Epo-Tek® ET301-2 General Bonding, Room Temperature Cure, 2-Part Epoxy, 2.5 Gram Packet
EPO-TEK® 301-2 is a two-component epoxy that can be cured with or without heat. In addition to its excellent optical properties, the 301-2 is a clear epoxy that has a low viscosity, long pot life (8 hrs.) and good handling characteristics. It was designed for optical applications such as a lens for optoelectronic display devices, bonding fiber optics (glass or plastic) and, for optical filters. EPO-TEK 301-2 can be used for bonding glass, quartz, metals and most plastics.
Advantages and Suggested Application Notes:
Advantages and Suggested Application Notes:
- Suggested for LCD optical lamination and sealing of glass plates. The product can resist yellowing over 17 days of continuous UV light exposure. Suitable for LED encapsulation.
- Ease of use: potting and casting, encapsulation and adhesive.
- Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level including wafer level packaging.
- Compliant adhesive that will be resistant to impact or vibrations. Low-stress adhesive for bonding optics inside OEM / Scientific instruments.
- Fiber optic adhesive: bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light. Adhesion to glass, quartz, metals, wood and most plastics is very good.
- May also be used for impregnating wooden or porous objects for artifact restoration.
- NASA-approved, low-outgassing epoxy