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Epo-Tek® ET301 General Room Temp Cure Epoxy (2.5G)
ET301-2.5G
Epo-Tek® ET301 General Bonding, Room Temp Cure, 2-Part Epoxy, 2.5 Gram Packet
EPO-TEK® 301 is a two-component, room-temperature curing epoxy featuring very low viscosity and excellent optical-mechanical properties.
Advantages and Suggested Application Notes:
Advantages and Suggested Application Notes:
- Semiconductor: optical glob top or underfill; adhesion to common wafer passivation, solder mask and flex circuits; compatible with LED die, Si, GaAs.
- PCB: general potting and protection over FR4, flex, or ceramic PCBs.
- Fiber Optic:
- Adhesive for glass and plastic fibers; wicking into fiber bundles used in patch cords, endoscopes or sensor devices; adhesive/seal/encapsulant used for fiber packaging and components; transmission of IR up to 2500 nm; terminating fibers into ferrules; fiber coupling and splicing.
- Opto-electronic:
- LCD/LED adhesive for laminating glass layers; adhesion to PET plastic; general potting, encapsulation, and protection; spectral transmission in VIS and IR light; adhesive/encapsulant for VCSEL's packaged devices; resisting yellowing per ASTM D1925; adhesive for precision optics including lens, prism, beam splitter cubes, mirrors, and diodes, found in medical, university, or research communities.
- NASA-approved, low-outgassing epoxy
