Epo-Tek® H20E Elect. Cond. Heat Cure Epoxy (2.5G)

EPO-TEK® H20E is a 100% solids, two component silver filled epoxy with a soft, smooth, thixotropic consistency designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. EPO-TEK H20E is especially recommended for use in highspeed epoxy chip bonding systems where very fast cures are highly desirable. This cannot be obtained with single-component systems. Because E can be cured very rapidly, it is an excellent material to use for making fast circuit repairs. E can be screen printed, machine dispensed or stamped and can withstand wire bonding temperatures in the range of 300 - 400°C. Extended pot life 2.5 days.

Advantages and Suggested Application Notes:

• Processing Info: It can be applied by many dispensing, stamping, and screen printing techniques Dispensing: Compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a single-component fashion.
• Screen Printing: Best using >200 metal mesh, with polymer squeegee blade with 80D hardness.
• Stamping: Small dots 6 mil in diameter can be realized.

See physical, optical and electrical/thermal properties in the datasheet.