EPO-TEK® H20E Electrically Conductive Silver Epoxy, Heat Cure (2.5g)

The EPO-TEK® H20E Electrically Conductive Epoxy is a two-component, 100% solids silver epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. 2.5-gram packet.

Features:

• Recommended Cure: 150°C / 1 Hour
• Pot life: 2.5 Days

Physical Properties:

• Consistency: Smooth thixotropic paste
• Viscosity (23°C): 2,200 - 3,200 cPs
• Thixotropic Index:  4.6
• Glass Transition Temperature, Tg: ≥ 80°C (degree Celsius); ≥ 176°F (degree Fahrenheit)
• Shore D Hardness: 75
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 31 x 10^-6 in/in°C
  • Above Tg: 158 x 10^-6 in/in°C
• Suggested Operating Temperature: < 300°C (Intermittent); < 572°F  
• Particle Size: ≤ 45 microns

Electrical and Thermal Properties:

• Thermal Conductivity: 2.5 W/mK based on standard method: Laser Flash
• Thermal Conductivity: 29 W/mK based on Thermal Resistance Data: R = L x K^-1 x A^-1)

See Datasheet for additional properties and application notes