Holiday Update:
Fiber Optic Center will be closed December 24 and 25.
Due to potential early carrier pickups, PLEASE HAVE ALL ORDERS IN BY NOON ON MONDAY, DECEMBER 23.


We will resume our regular business hours on Thursday, December 26.

Fiber Optic Center will be at Photonics West - Schedule your meeting with a member of the FOC team now

EPO-TEK® H20E Electrically Conductive Silver Epoxy, Heat Cure (2.5g)

ETH20E-2.5G

EPO-TEK® H20E Electrically Conductive, Heat Cure, 2-Part Epoxy, 2.5 Gram Packet

Extended Pot Life 2.5 days
The EPO-TEK® H20E Electrically Conductive Epoxy is a two-component, 100% solids silver epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. 2.5-gram packet.

Features:
  • Recommended Cure: 150°C / 1 Hour
  • Pot life: 2.5 Days
Physical Properties:
  • Consistency: Smooth thixotropic paste
  • Viscosity (23°C): 2,200 - 3,200 cPs
  • Thixotropic Index:  4.6
  • Glass Transition Temperature, Tg: ≥ 80°C (degree Celsius); ≥ 176°F (degree Fahrenheit)
  • Shore D Hardness: 75
  • Coefficient of Thermal Expansion (CTE):
    • Below Tg: 31 x 10-6 in/in°C
    • Above Tg: 158 x 10-6 in/in°C
  • Suggested Operating Temperature: < 300°C (Intermittent); < 572°F  
  • Particle Size: ≤ 45 microns
Electrical and Thermal Properties:
  • Thermal Conductivity: 2.5 W/mK based on standard method: Laser Flash
  • Thermal Conductivity: 29 W/mK based on Thermal Resistance Data: R = L x K-1 x A-1)
See Datasheet for additional properties and application notes