Silver-filled epoxy with a smooth thixotropic paste designed for chip bonding in microelectronic and optoelectronic applications. Tg: ≥ 80°C. Shop Now.
The EPO-TEK® H20E Electrically Conductive Epoxy is a two-component, no solvents added silver epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. 2.5-gram packet.