EPO-TEK^® H20E Electrically Conductive Silver Epoxy, Heat Cure (2.5g)

The EPO-TEK® H20E Electrically Conductive Epoxy is a two-component, no solvents added silver epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. 2.5-gram packet.

Features:

• Recommended Cure: 150°C / 1 Hour
• Pot life: 2.5 Days

Physical Properties:

• Consistency: Smooth thixotropic paste
• Viscosity (23°C): 2,200 - 3,200 cPs
• Thixotropic Index:  4.6
• Glass Transition Temperature, Tg: ≥ 80°C (degree Celsius); ≥ 176°F (degree Fahrenheit)
• Shore D Hardness: 75
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 31 x 10^-6 in/in°C
  • Above Tg: 158 x 10^-6 in/in°C
• Suggested Operating Temperature: < 300°C (Intermittent); < 572°F  
• Particle Size: ≤ 45 microns

Electrical and Thermal Properties:

• Thermal Conductivity: 2.5 W/mK based on standard method: Laser Flash
• Thermal Conductivity: 29 W/mK based on Thermal Resistance Data: R = L x K^-1 x A^-1)

See Datasheet for additional properties and application notes