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EPO-TEK® H70E Thermally Conductive & Electrically Insulating Epoxy, Heat Cure (4g)
EPO-TEK® H70E Thermally Conductive & Electrically Insulating Epoxy, Heat Cure (4g)
ETH70E-4G EPO-TEK® H70E Thermally Conductive, Electrically Insulating, Heat Cure, 2-Part Epoxy, 4 Gram Packet
The EPO-TEK® H70E Epoxy is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. 4 Gram Packet.
Features:
Passes NASA low outgassing standard ASTM E595 with proper cure
Pot Life: 56 hours
Recommended Cure: 150°C / 1 Hour
Physical Properties:
Consistency: Slightly pourable paste
Viscosity (23°C): 4,000 - 7,000 cPs
Glass Transition Temperature, Tg: ≥ 80°C (degree Celsius); ≥ 176°F (degree Fahrenheit)
Thixotropic Index: 1.2
Shore D Hardness: 83
Coefficient of Thermal Expansion (CTE):
Below Tg: 15 x 10-6 in/in°C
Above Tg: 64 x 10-6 in/in°C
Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F
Particle Size: ≤ 50 microns
Thermal and Electrical Properties:
Thermal Conductivity: 0.9 W/mK
See Datasheet for additional properties and application notes
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