EPO-TEK^® H70E Thermally Conductive & Electrically Insulating Epoxy, Heat Cure (4g)

The EPO-TEK® H70E Epoxy is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. 4 Gram Packet.

Features:

• Passes NASA low outgassing standard ASTM E595 with proper cure
• Pot Life: 56 hours
• Recommended Cure: 150°C / 1 Hour

Physical Properties:

• Consistency: Slightly pourable paste
• Viscosity (23°C): 4,000 - 7,000 cPs
• Glass Transition Temperature, Tg: ≥ 80°C (degree Celsius); ≥ 176°F (degree Fahrenheit)
• Thixotropic Index: 1.2
• Shore D Hardness: 83
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 15 x 10^-6 in/in°C
  • Above Tg: 64 x 10^-6 in/in°C
• Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F  
• Particle Size: ≤ 50 microns

Thermal and Electrical Properties:

• Thermal Conductivity: 0.9 W/mK

See Datasheet for additional properties and application notes