Holiday Update:
Fiber Optic Center will be closed December 24 and 25.
Due to potential early carrier pickups, PLEASE HAVE ALL ORDERS IN BY NOON ON MONDAY, DECEMBER 23.


We will resume our regular business hours on Thursday, December 26.

Fiber Optic Center will be at Photonics West - Schedule your meeting with a member of the FOC team now

EPO-TEK® H70E Thermally Conductive & Electrically Insulating Epoxy, Heat Cure (4g)

ETH70E-4G

EPO-TEK® H70E Thermally Conductive, Electrically Insulating, Heat Cure, 2-Part Epoxy, 4 Gram Packet
The EPO-TEK® H70E Epoxy is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. 4 Gram Packet.

Features:
  • Passes NASA low outgassing standard ASTM E595 with proper cure
  • Pot Life: 56 hours
  • Recommended Cure: 150°C / 1 Hour
Physical Properties:
  • Consistency: Slightly pourable paste
  • Viscosity (23°C): 4,000 - 7,000 cPs
  • Glass Transition Temperature, Tg: ≥ 80°C (degree Celsius); ≥ 176°F (degree Fahrenheit)
  • Thixotropic Index: 1.2
  • Shore D Hardness: 83
  • Coefficient of Thermal Expansion (CTE):
    • Below Tg: 15 x 10-6 in/in°C
    • Above Tg: 64 x 10-6 in/in°C
  • Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F  
  • Particle Size: ≤ 50 microns
Thermal and Electrical Properties:
  • Thermal Conductivity: 0.9 W/mK
See Datasheet for additional properties and application notes