EPO-TEK® H70E Thermally Conductive & Electrically Insulating Epoxy, Heat Cure (4g)

The EPO-TEK^® H70E Epoxy is a two-component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications. Recommended Cure: 150°C for 1 Hour. Available in a 4-gram packet.

Features of H70E:

• Heat-sinking adhesive recommended for thermal management applications
• Passes NASA low outgassing standard ASTM E595 with proper cure 
• Pot life: 56 hours — long room-temperature pot life without solvents
• Excellent handling characteristics
• Can be cured rapidly for fast processing
• Easy to use

Applications:

• Die-attach adhesive for high-temperature (up to 300°C) applications; compatible with TC wire bonding; meets JEDEC Level II and III packaging criteria
• Chip bonding in microelectronics and optoelectronics
• Fast circuit repairs and in-line die bonding (snap-cure capable)
• Suitable for screen printing, machine dispensing, stamping, or hand application
• Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddles, glass, ceramic, Kovar, and PCB

Physical Properties:

• Color (before cure)
  • Part A: Grey
  • Part B: Beige
• Consistency: Slightly pourable paste
• Viscosity (23°C): 4,000 - 7,000 cPs
• Glass Transition Temperature, Tg: ≥ 80°C
• Thixotropic Index: 1.2
• Shore D Hardness: 83
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 15 x 10^-6 in/in°C
  • Above Tg: 64 x 10^-6 in/in°C
• Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F
• Particle Size: ≤ 50 microns

Thermal and Electrical Properties:

• Thermal Conductivity: 0.9 W/mK
• Volume Resistivity @ 23°C: ≥ 1 x 10¹³ Ohm-cm   
• Dielectric Constant (1KHz): 4.22 
•  Dissipation Factor (1KHz): 0.004

See Datasheet for additional properties and application notes