EPO-TEK® OG116-31 High Tg Epoxy, UV & Heat Cure (3cc Syringe)

The EPO-TEK® OG116-31 High Temperature Epoxy is a single component, UV cure epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical and scientific/OEM industries. High Tg and low outgassing are indicative of its high-temperature performance. 3cc automatic epoxy syringe.

Physical Properties:

• Consistency: Viscous liquid
• Viscosity (23°C): 20,000 - 30,000 cPs
• Thixotropic Index: 1.3
• Glass Transition Temperature, Tg: ≥ 115°C (degree Celsius); ≥ 239°F (degree Fahrenheit)
• Shore D Hardness: 83
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 41 x 10^-6 in/in°C
  • Above Tg: 170 x 10^-6 in/in°C
• Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F  
• Particle Size: ≤ 20 microns

Optical Properties:

• Spectral Transmission:
  • ≥ 96% @ 660-1,640nm
  • ≥ 92% @ 500nm
• Refractive Index (uncured): 1.5665 @ 589nm
• Refractive Index (cured): 1.5842 @ 589nm

See Datasheet for additional properties and application notes