EPO-TEK® OG116-31 High Tg Epoxy, UV & Heat Cure (3cc Syringe)

The EPO-TEK® OG116-31 High Temperature Epoxy is a single component, UV cure epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical and scientific/OEM industries. High Tg and low outgassing are indicative of its high-temperature performance. Available in a 3cc automatic epoxy syringe.

Recommended Cure: Iron-Doped Mercury Flood Lamp > 30 sec. 40 mW/cm² @ 240-365 nm

Features of OG116-31:

• UV cure adhesive and encapsulant
• High Tg and low outgassing epoxy
• Viscosity/rheology adapted to high volume syringe needle dispensing with no tailing
• Versatility in cure. Product responds to a broad range of UV light, and secondary thermal post-curing
• Compliant with Telcordia GR-1221

Applications:

• Fiber Optic: Fiber optic pigtails, active alignment of optics, and adhesion to glass, metals, ceramics, and plastics
• Semiconductor: COB glob top covering IC’s and wire bonds; glob top dam; encapsulating and sealing; adhesion to FR4, Kapton, silicon
• Opto-electronic: Perimeter/main seal for LCD’s, compatible with VAN liquid crystal for LCoS devices

Physical Properties:

• Color (before cure): Cloudy White
• Consistency: Viscous liquid
• Viscosity (23°C): 20,000 - 30,000 cPs
• Thixotropic Index: 1.3
• Glass Transition Temperature, Tg: ≥ 115°C
• Shore D Hardness: 83
• Coefficient of Thermal Expansion (CTE):
  • Below Tg: 41 x 10^-6 in/in°C
  • Above Tg: 170 x 10^-6 in/in°C
• Weight Loss:
  • @ 200°C: 0.30%
  • @ 250°C: 0.68%
  • @ 300°C: 1.18%
• Suggested Operating Temperature: < 300 °C (Intermittent); < 572°F  
• Particle Size: ≤ 20 microns

Optical Properties:

• Spectral Transmission:
  • ≥ 96% @ 660-1,640nm
  • ≥ 92% @ 500nm
• Refractive Index (uncured): 1.5665 @ 589nm
• Refractive Index (cured): 1.5842 @ 589nm

See Datasheet for additional properties and application notes