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Low Outgassing Epoxy and Adhesives
Product Comparison Table
Low outgassing adhesives are designed to minimize the release of volatile gases when exposed to heat, reduced pressure, or both. In fiber optics, even small amounts of outgassing from adhesives used in connectors can cause contamination, leading to signal loss and reduced reliability.
In aerospace applications, materials are evaluated using ASTM E595, a NASA low outgassing test standard, in which samples are exposed to 125 °C for 24 hours in a vacuum and must meet ≤1.0% Total Mass Loss (TML) and ≤0.10% Collected Volatile Condensable Material (CVCM).
In fiber optic applications, material may be tested in accordance with Telcordia GR-1221, which uses thermogravimetric analysis (TGA) to measure weight loss and to confirm proper cure. For this test, the cured adhesive is heated from 50°C to 150°C at 5°C/minute in the TGA. A 0.1% weight loss for heat cured systems and a 0.25% weight loss for UV cured systems is considered evidence that it meets test requirements.
In military applications, materials may be evaluated in accordance with MIL-STD-883, Method 5011. This test measures weight loss at 200°C as the material is heated from room temperature at a rate of 10°C/minute or 20°C/minute under a nitrogen flow and weight loss must be less than 1%.
Use the comparison table below to evaluate low outgassing adhesives and identify the right material for your application. If you have any questions, please contact Kelly Barker, Epoxy Expert.
| Product | Adhesive Type | Passes NASA ASTM E595 |
TML* | CVCM** | Passes Telcordia GR-1221 |
Curing | Pot Life | Viscosity (cps) | Tg (°C) | Coefficient of Thermal Expansion (CTE) |
|---|---|---|---|---|---|---|---|---|---|---|
| Optical Adhesive US Navy Approved MIL-SPEC Approved: MIL-PRF-24792A Room Temp or Heat Cure Epoxy for Multimode and Single Mode Terminations |
Yes (MIL-PRF-24792A follows ASTM E595) |
Unspecified | Unspecified | Not Tested | Passes MIL-PRF-24792A with (Follows ASTM E595):
|
40 Minutes |
2,000 | 93.5°C | 55.7 x 10-6 in/in°C | |
| Optical Adhesive Heat Cure Epoxy for Multimode and Single Mode Terminations |
Yes | 0.85% | 0.00% | Not Tested | Passes NASA Low Outgassing with:
|
60-90 Minutes |
< 1,800 | 110°C | 70ppm (est. below Tg) | |
| Optical Adhesive Heat Cure Epoxy for Multimode and Single Mode Terminations |
Yes | 0.85% | 0.00% | Not Tested | Passes NASA Low Outgassing with:
|
60-90 Minutes | < 1,800 | 110°C | 70ppm (est. below Tg) | |
| Silver Filled Electrically & Thermally Conductive Epoxy |
Yes | 0.47% | 0.01% | Yes Weight loss: 0.02% |
Passes NASA Low Outgassing with:
3 Hours |
50,000 |
77°C |
alpha1 ~70 ppm/°C, alpha2 ~140 ppm/°C |
| |
| Optical Adhesive MIL-SPEC Approved: MIL-STD 883/5011 Epoxy for Solder Reflow process UV, LED + Thermal Post Cure |
No | Not Tested | Not Tested | Yes Weight loss: 0.23% |
See Data Sheet for curing information | 3 Months |
900-1,200 | 145-150°C | Below Tg: 42°C-1 (x10-6) Above Tg: 86°C-1 (x10-6) |
|
| Optical Adhesive MIL-SPEC Approved: MIL-STD 883/5011 MIL-SPEC Approved: MIL-PRF-24792A Epoxy for Solder Reflow process UV, LED + Thermal Post Cure |
Yes | 0.41% | < 0.01% | Yes Weight loss: 0.10% |
See Data Sheet for curing information | 3 Months |
3,500-4,500 | 165-175°C | Below Tg: 28°C-1 (x10-6) Above Tg: 82°C-1 (x10-6) |
|
| Optical Adhesive High Temperature Epoxy |
Yes | 0.76% | 0.01% | Yes Weight loss: 0.37% |
Passes NASA Low Outgassing with:
|
≤ 3 Hours | 3,000-5,000 | ≥ 90°C | Below Tg: 54 x 10-6 in/in°C Above Tg: 206 x 10-6 in/in°C |
|
| Optical Adhesive High Temperature Humidity Resistant Epoxy |
Yes | 0.76% | < 0.01% | Yes Weight loss: TBD |
Passes NASA Low Outgassing with:
|
≤ 3 Hours | 3,600 | ≥ 90°C | Below Tg: 52 x 10-6 in/in°C Above Tg: 185 x 10-6 in/in°C |
|
| Optical Adhesive Hybrid UV and Heat-Cure Epoxy |
Yes | 0.93% | 0.01% | Not Tested | Unspecified | < 3 Days |
25,000-41,000 | ≥ 80°C | Below Tg: 71 x 10-6 in/in°C Above Tg: 178 x 10-6 in/in°C |
|
| Optical Adhesive Clear and Colorless Spectrally Transparent Room Temp or Low Heat Cure Epoxy |
Yes | 0.98% | 0.01% | Not Tested | Passes NASA low Outgassing with:
|
1-2 Hours | 100-200 | ≥ 65°C | Below Tg: 39 x 10-6 in/in°C Above Tg: 98 x 10-6 in/in°C |
|
| Optical Adhesive Clear and Colorless Optically Transparent Room Temp or Low Heat Cure Epoxy |
Yes | 0.89% | 0.01% | Not Tested | Passes NASA Low Outgassing with:
|
8 Hours | 225-425 | ≥ 80°C | Below Tg: 61 x 10-6 in/in°C Above Tg: 180 x 10-6 in/in°C |
|
| Optical Adhesive Clear and Colorless Optically Transparent Room Temp or Low Heat Cure Epoxy |
Yes | 0.70% | 0.01% | Not Tested | Passes NASA Low Outgassing with:
|
1 Hour | 800-1,600 | ≥ 55°C | Below Tg: 56 x 10-6 in/in°C Above Tg: 193 x 10-6 in/in°C |
|
| Optical Adhesive Long Pot Life High Temperature Epoxy |
Not Tested | Not Tested | Not Tested | Yes Weight loss 0.070% |
Passes Telcordia GR-1221 with:
|
24 Hours | 3,500-5,000 | ≥ 100°C | Below Tg: 51 x 10-6 in/in°C Above Tg: 185 x 10-6 in/in°C |
|
| Optical Adhesive Down Hole Applications High Temperature Epoxy |
Not Tested | Not Tested | Not Tested | Yes Weight loss: 0.41% |
Passes Telcordia GR-1221 with:
|
4 Hours | 3,000-5,000 | ≥ 100°C | Below Tg: 48 x 10-6 in/in°C Above Tg: 192 x 10-6 in/in°C |
|
| Optical Adhesive Long Pot Life High Temperature Epoxy Electrically and Thermally Insulating |
Not Tested | Not Tested | Not Tested | Yes Weight loss: 0.85% |
Passes Telcordia GR-1221 with:
|
4 Hours | 3,000-5,000 | ≥ 100°C | Below Tg: 34 x 10-6 in/in°C Above Tg: 129 x 10-6 in/in°C |
|
| Optical Adhesive UV Cure Epoxy Secondary Heat Post Cure |
Yes | 0.77% | 0.09% | Yes Weight loss: 0.87% |
Passes Telcordia GR-1221 with:
|
Open | 20,000-30,000 | ≥ 115°C | Below Tg: 41 x 10-6 in/in°C Above Tg: 170 x 10-6 in/in°C |
|
| Optical Adhesive Shadow Curable UV Cure Epoxy Secondary Heat Post Cure Electrically and Thermally Insulating |
Yes | 0.53% | 0.00% | Yes Weight loss: 0.84% |
Passes Telcordia GR-1221 with:
|
Open | 200-450 | ≥ 115°C | Below Tg: 74 x 10-6 in/in°C Above Tg: 145 x 10-6 in/in°C |
|
| Electrically Insulating Thermally Conductive Epoxy |
Yes | 0.99% | 0.03% | Not Tested | Passes NASA Low Outgassing with:
|
56 Hours | 4,000-7,000 | ≥ 80°C | Below Tg: 15 x 10-6 in/in°C Above Tg: 64 x 10-6 in/in°C |
|
| High Temperature Thermally Conductive Adhesive |
Yes | 0.56% | 0.00% | Not Tested | Passes NASA Low Outgassing with:
|
2 Hours | 45,000-65,000 | ≥ 100°C | Below Tg: 21 x 10-6 in/in°C Above Tg: 95 x 10-6 in/in°C |
|
| Silver Filled Electrically & Thermally Conductive Adhesive |
Yes | 0.62% | 0.01% | Not Tested | Passes NASA Low Outgassing with:
|
2.5 Days | 2,200-3,200 | ≥ 80°C | Below Tg: 31 x 10-6 in/in°C Above Tg: 158 x 10-6 in/in°C |
|
| Optical Adhesive High Temperature Epoxy |
Yes | 0.54% | 0.02% | Not Tested | Passes NASA Low Outgassing with:
|
24 Hours | 150-300 | ≥ 95°C | Below Tg: 57 x 10-6 in/in°C Above Tg: 210 x 10-6 in/in°C |
|
| Optical Adhesive Low Shrinkage UV, LED + Heat Cure Epoxy Heat Cure Only Capability |
Yes | 0.37% | 0.01% | Not Tested | Passes NASA Low Outgassing with:
|
7 Days | 60,000 | 153°C | Below Tg: 25 µm/m/°C Above Tg: 97 µm/m/°C |
|
| Optical Adhesive Low Shrinkage UV, LED + Heat Cure Epoxy Heat Cure Only Capability |
Yes | 0.23% | 0.01% | Not Tested | Passes NASA Low Outgassing with:
|
5 Days | 86,000 | 184°C | Below Tg: 31 µm/m/°C Above Tg: 77 µm/m/°C |
|
**Collected Volatile Condensable Materials (CVCM)