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'life' Product Search Results
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- EPO-TEK® 323LP High Temperature Epoxy, Heat Cure (15g)
EPO-TEK® 323LP Epoxy is a two component, high temperature epoxy designed for semiconductor, hybrid, ...
Part: ET323LP-15G - EPO-TEK® 383ND High Temperature Epoxy, Heat Cure (8oz)
The EPO-TEK® 383ND Epoxy is a two component, high temperature, electrically and thermally insulating...
Part: ET383ND-8OZ - EPO-TEK® 323LP High Temperature Epoxy, Heat Cure (8oz)
EPO-TEK® 323LP Epoxy is a two component, high temperature epoxy designed for semiconductor, hybrid, ...
Part: ET323LP-8OZ - EPO-TEK® 323LP High Temperature Epoxy, Heat Cure (4g)
The EPO-TEK® 323LP Epoxy is a two-component, high-temperature epoxy designed for semiconductor, hybr...
Part: ET323LP-4G - REQUEST A SAMPLEEPO-TEK® 323LP High Temperature Epoxy, Heat Cure (2.5g)
The EPO-TEK® 323LP Epoxy is a two-component, high-temperature epoxy designed for semiconductor, hybr...
Part: ET323LP-2.5G - REQUEST A SAMPLEEPO-TEK® 383ND High Temperature Epoxy, Heat Cure (4g)
The EPO-TEK® 383ND Epoxy is a two-component, high-temperature, electrically and thermally insulating...
Part: ET383ND-4G - REQUEST A SAMPLEEPO-TEK® 383ND High Temperature Epoxy, Heat Cure (2.5g)
The EPO-TEK® 383ND Epoxy is a two-component, high-temperature, electrically and thermally insulating...
Part: ET383ND-2.5G - EPO-TEK® 323LP High Temperature Epoxy, Heat Cure - Pre-Mixed and Frozen (3cc Syringe)
EPO-TEK® 323LP Epoxy is a two-component, high-temperature epoxy designed for semiconductor, hybrid, ...
Part: ET323LP-3CC - EPO-TEK® 383ND High Temperature Epoxy, Heat Cure - Pre-Mixed and Frozen (3cc Syringe)
EPO-TEK® 383ND High Temperature Epoxy is a two component, electrically and thermally insulating epox...
Part: ET383ND-3CC - LOCTITE® Hysol 0151 Epoxy, Room Temperature & Heat Cure (4g)
The LOCTITE® Hysol 0151 Epoxy is a clear, two-component epoxy known for its optical clari...
Part: 0151-4G - LOCTITE® Hysol 0151 Epoxy, Room Temperature & Heat Cure (2.5g)
The LOCTITE® Hysol 0151 Epoxy is a clear, two-component epoxy known for its optical clari...
Part: 0151-2.5G - REQUEST A SAMPLEÅngströmBond® AB9112 MIL-SPEC Fiber Optic Epoxy, Room Temperature & Heat Cure (2.5g)
The ÅngströmBond® 9112 MIL-SPEC Epoxy is a blue, room temperature and heat curing fiber o...
Part: AB9112-2.5G - ÅngströmBond® AB9119 Epoxy, Heat Cure (2.5g)
The ÅngströmBond® AB9119 is a heat cure epoxy that reduces the risk of dermatitis. This low viscosit...
Part: AB9119-2.5G - REQUEST A SAMPLEEPO-TEK® H20E Electrically Conductive Silver Epoxy, Heat Cure (2.5g)
The EPO-TEK® H20E Electrically Conductive Epoxy is a two-component, no solvents added silver epoxy s...
Part: ETH20E-2.5G - REQUEST A SAMPLEÅngströmBond® AB9123 High Temperature Epoxy, Heat Cure (2.5g)
The ÅngströmBond® 9123 Epoxy is a very fast-curing, high-temperature fiber optic connecto...
Part: AB9123-2.5G - REQUEST A SAMPLEÅngströmBond® AB9113SC Epoxy, Room Temperature & Heat Cure (2.5g)
The ÅngströmBond® 9113SC is a blue, fiber optic connector epoxy based on one of the most ...
Part: AB9113SC-2.5G - REQUEST A SAMPLEÅngströmBond® AB9123 High Temperature Blue Epoxy, Heat Cure (2.5g)
The ÅngströmBond® 9123 Blue Epoxy is a very fast-curing, high-temperature fiber optic con...
Part: AB9123BLUE-2.5G - REQUEST A SAMPLEÅngströmBond® AB9320 Blue Epoxy, Heat Cure (2.5g)
The ÅngströmBond® 9320 is a low stress, heat cured blue epoxy designed for terminating multimode and...
Part: AB9320-2.5G - REQUEST A SAMPLEÅngströmBond® AB9195 Flexible Epoxy, Room Temperature & Heat Cure (2.5g)
The ÅngströmBond® AB9195 is a low viscosity, flexible adhesive designed for bonding and e...
Part: AB9195-2.5G - ÅngströmBond® AB9190 Low Viscosity Clear Epoxy, Room Temperature Cure (2.5g)
The ÅngströmBond® 9190 Clear Epoxy is a very low viscosity, rigid epoxy system specially ...
Part: AB9190-2.5G - REQUEST A SAMPLEEPO-TEK® 320 Black Epoxy, Room Temperature Cure (2.5g)
The EPO-TEK® 320 Black Epoxy is a two-component, low viscosity and optically opaque epoxy designed f...
Part: ET320-2.5G - REQUEST A SAMPLEÅngströmBond® AB9001MT Thixotropic Epoxy, Room Temperature & Heat Cure (2.5g)
The ÅngströmBond® 9001 MT Epoxy is a two-part, room temperature curing adhesive designed specificall...
Part: AB9001MT-2.5G - REQUEST A SAMPLEÅngströmBond® AB9110LV Clear Epoxy for PM and POF fiber, Room Temperature & Heat Cure (2.5g)
The ÅngströmBond® 9110LV is a low viscosity, clear epoxy recommended for industrial adhes...
Part: AB9110LV-2.5G - REQUEST A SAMPLEÅngströmBond® AB9320 Clear Epoxy, Heat Cure (2.5g)
The ÅngströmBond® 9320 Epoxy is a low stress, heat cured clear epoxy designed for termina...
Part: AB9320CLR-2.5G